Designed for power component packaging post die and wire bonding defect detection.
Combined 2D camera & 3D structured light image capture for rapid inspection.
Compatible with conveyor track to allow for inline testing and features offline testing with automatic loading and unloading.
Al-powered smart programming vastly improves programming efficiency.
Completely offline programming capabilities - debugging without stopping production.
Flexible lighting and adjustable Z-axis easily handle complicated inspection situations.
Links with MES systems, supports TCP/IP, SECS/GEM communication protocols and more.
Advanced SPC capabilities support data review and process analysis.
