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Semiconductor Bonding AOl

Rapid & Easy Use 3D Inspection

Designed for power component packaging post die and wire bonding defect detection.

Combined 2D camera & 3D structured light image capture for rapid inspection.

Compatible with conveyor track to allow for inline testing and features offline testing with automatic loading and unloading.

Al powered smart programming vastly improves programming efficiency.

Completely offline programming capabilities - debugging without stopping production.

Flexible lighting and adjustable Z axis easily handle complicated inspection situations.

Links with MES systems, supports TCP/IP, SECS/GEM communication protocols and more.

Advanced SPC capabilities support data review and process analysis.

Semiconductor Bonding AOl
Technology & Advantages Technical Specification




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