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Core Business

Magic-ray’s leading products are automatic optical inspection equipment (AOI), solder paste inspection equipment(SPI) and automatic X-ray inspection equipment(AXI), that use optical imaging principles and software algorithms to achieve fully automatic product inspection. Magic-ray actively participates in quality control and process optimization in the production fields of diversified industries, including circuit board assembly (PCBA), Semiconductor Chip Packing, Mini LED Display, computers, telecommunications, automobiles, mobile phones, home appliances and health care industry.

MagicRay offers fast, accurate, powerful, and easy-to-use visual inspection solutions for industrial automation.

PCBA检测

PCBA Inspection

Semiconductor Packaging Inspection

Mini/Micro LED Inspection

PCBA Inspection

All electrical and electronic products contain printed circuit boards. Magic-ray provides a whole line inspection resolution from SPI to pre-reflow/after-reflow AOI and Conformal Coating AOI, and offers a complete inspection of placement, component, solder joints, and coating of the entire PCBAboard, based on the characteristics of different electronic product motherboards and production. It aids in the analysis and improvement of the entire line’s production process by using centralized statistics and analysis feedback on the inspection data from each station.
Magic-ray offers mature and professional visual inspection solutions for a wide range of PCB boards, including precision-assembled PCBA, such as mobile phone and laptop motherboards, or large-scale PCBA, such as server motherboards and communication base station boards, with a wide variety of components, as well as automotive electronics and industrial-grade circuit boards with extremely high-reliability requirements, or small batches of multi-variety home appliance circuit boards that require frequent wiring changes.

The equipment combines powerful imaging with a flexible and meticulous logic algorithm to capture all defects on components, such as wrong parts, missing parts, reverse and offset, various defects in solder joints, and the entire PCBA (like foreign objects, excess parts, solder balls).

Magic-ray’s 3D technology application displays component defects in three dimensions; SPI inspection intercepts most of the majority of the defect forming factors in the front production line; double-sided AOI is equipped with both SMT and DIP algorithms to achieve simultaneous detection of the front and back sides of the PCB; our multifunctional coating AOI not only detects coating quality under UV light but also applies to SMT and DIP testing and AXI is suitable for in line non-destructive inspection of SMT, DIP and semiconductor IGBT.

Adhering to the design concept of “making the machine smarter,” Magic-ray constantly improves the application and programming of the machine. By collecting data from all testing equipment via the Internet to achieve monitoring and centralized management of the production data, the iFactory Solutions not only satisfy mass production shared by multiple machines but also offer simple and easy detection with a high-detectable rate and high-through rate for flexible production of small batches and multiple varieties.
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Semiconductor Packaging Inspection

The semiconductor production process consists of wafer fabrication, wafer testing, chip packaging, and packing testing. Semiconductor packaging inspection refers to the process of processing wafers that pass the test to obtain independent chips according to the product model and function requirements. Such products are characterized by their high precision and high value. Therefore, AOI inspection is very important for optimizing processes and product quality. Magic-ray provides a comprehensive inspection of passive components, chip surfaces, PCB surfaces, and wire bonding joints.
In the semiconductor packaging industry, the wire bonding process, or flip-chip process, is primarily used to realize the electrical interconnection between the chip and the PCB as well as information exchange between the chips. Typically, such products have a large number of sub-boards and each sub-board has a large number of gold wires or chips. Their defective features are small, and manual inspection cannot provide a thorough examination. Furthermore, semiconductor products are generally of high value.

Magic-ray ensures a high-precision inspection in this field by utilizing our professional AOI, which is outfitted with a high-precision linear motor platform and high-resolution lens. Our machine, which is equipped with a dedicated gold wire detection algorithm, gold finger, and PCB detection algorithm, can provide specific high-precision detection solutions for chips, PCB, gold fingers, gold wires, and other components. In addition, it can be outfitted with a loading and unloading machine, as well as vacuum suction, push rod, and other mechanisms to achieve sealing off-line detection of automatic loading and unloading. It can participate in the docking of SECS/GEM and MES, as well as data intercommunication with the equipment of the entire line.

Adhering to the design concept of “making the machine smarter,” Magic-ray constantly improves the application and programming of the machine. By collecting data from all testing equipment via the Internet to achieve monitoring and centralized management of the production data, the iFactory Solutions not only satisfy mass production shared by multiple machines but also offer simple and easy detection with a high-detectable rate and high-through rate for flexible production of small batches and multiple varieties.
iFactory Solutions

Mini/Micro LED Inspection

Mini LED is an LED chip with a size of 100 microns. Mini LED is a high-density and tiny-sized LED array that is integrated into a PCB. The stronger the light energy, the more precise the area where the light can be controlled. Magic-ray offers whole-line inspection solutions in the field of mini LED backlight and direct display applications, such as solder paste inspection after printing, pre-reflow and after-reflow oven inspection, after die bonding, and lens coating inspection after backlight dispensing.
In the Mini LED process, the size of the lamp beads and the dot pitch continue to shrink. With the increase of the geometric multiple of the partition, there are advantages over traditional displays in terms of contrast, resolution, brightness, viewing angle, color performance, and lifespan. However, because the lamp beads are only 50-200um in size and the number reaches 100,000, it can only be detected by equipment instead of manual inspection.

Magic-ray Mini LED AOI uses an ultra-high-precision lens that can support the minimum detection of 3*5mil chips and the detection of over 100,000 chips. The excellent contour cutting algorithm can accurately locate and cut the coating contour, and effectively detect the offset, diameter, eccentric distance, and other defects. For the detection of transparent coating, the AI algorithm can be used to comprehensively detect low-contrast defects such as air bubbles, wrinkles, and collapses. At the same time, based on the centralized statistics and analysis feedback on inspection data from each station, it aids in the analysis and improvement of the entire line’s production process.

Adhering to the design concept of “making the machine smarter,” Magic-ray constantly improves the application and programming of the machine. By collecting data from all testing equipment via the Internet to achieve monitoring and centralized management of the production data, the iFactory Solutions not only satisfy mass production shared by multiple machines but also offer simple and easy detection with a high-detectable rate and high-through rate for flexible production of small batches and multiple varieties.
iFactory Solutions

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