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Semiconductor Packaging AOI

Efficient Wire Bonding Automatic Vision Inspection

For the inspection of semiconductor packaging after D/W and W/B process.

High speed, high reliability: Granite platform + Linear motor + Three-section buffer structure.

Adjustable z axis: the program automatically adjusts the z axis.

High precision: 12 megapixel industrial color camera + low distortion telecentric lens.

Full-auto magazine loader & unloader of large capacity.

Offline programming and debugging in real-time without stopping the production line.

Detection of covered gold wire, copper wire, aluminum wire and palladium-plated copper wire.

Support uploading MES for Mapping.

NG material mark.

Vacuum suction platform for warpage and flexible PCB.

Semiconductor Packaging AOI
Technology & Advantages Technical Specification



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