For the inspection of semiconductor packaging after D/W and W/B process.
High speed, high reliability: Granite platform + Linear motor + Three-section buffer structure.
Adjustable z axis: the program automatically adjusts the z axis.
High precision: 12 megapixel industrial color camera + low distortion telecentric lens.
Full-auto magazine loader & unloader of large capacity.
Offline programming and debugging in real-time without stopping the production line.
Detection of covered gold wire, copper wire, aluminum wire and palladium-plated copper wire.
Support uploading MES for Mapping.
NG material mark.
Vacuum suction platform for warpage and flexible PCB.
